EPX 82 | Epoxy

Material

Technology: Digital Light Processing

Digital Light Processing (DLP) - EPX 82

Description

Carbon’s EPX 82 epoxy digital light processing material is a high-strength resin optimized for advanced manufacturing applications. It has been specifically formulated to offer exceptional performance and durability, with several critical advantages over other materials in its class. For example, EPX 82 can produce parts with extraordinary stiffness and strength and withstand high temperatures and harsh environments. Additionally, it can be easily post-processed to add features like threaded inserts and other secondary operations. This makes it an ideal material for various applications, including automotive and aerospace components, high-tech electronics, and medical devices. With its exceptional properties and ease of use, EPX 82 is a top choice for manufacturers and innovators looking to create high-quality, high-performance parts.

EPX 82 Applications

  • Automotive Components
  • Brackets
  • Connectors
  • Enclosures
  • Housings
  • Medical Devices

Resources

Material Manufacturer: Carbon

EPX 82 Characteristics

Black

  • Good for Snap Fits
  • High Strength
  • Impact Resistant
  • Rigid
  • Temperature Resistant

EPX 82 Mechanical Properties

Tolerance Guide
Based on a .08 in wall thickness.
General Accuracy
± 0.003 in + 0.013 in/in
Production Repeatability
(95% of points)
± 0.002 in
Additional XYZ Scale Factor
(Wall Thickness)
0.02 in: 1.025
0.04 in: 1.015
0.1 in: 1.004
0.3 in: 1.000

Mechanical Properties

Tensile Strength
10 ksi
Tensile Modulus
410 ksi
Tensile Elongation at Break
5%
Flexural Stress at 5% strain
19 ksi
Flexural Modulus
430 ksi
Heat Deflection at 264 psi
250° F
Tolerance Guide
Based on a 2 mm wall thickness.
General Accuracy
± 0.075 mm + 0.33 mm/mm
Production Repeatability
(95% of points)
± 0.05 mm
Additional XYZ Scale Factor
(Wall Thickness)
0.5 mm: 1.025
1 mm: 1.015
2.5 mm: 1.004
7.6 mm: 1.000

Mechanical Properties

Tensile Strength
8 MPa
Tensile Modulus
2800 MPa
Tensile Elongation at Break
5%
Flexural Stress at 5% strain
130 MPa
Flexural Modulus
3000 MPa
Heat Deflection at 264 psi
120° C

Digital Light Processing

Technology
Max Build Area

7.4 x 4.6 x 12.8 in

Lead Time

1 – 4 Days

Layer Thickness
  • Standard Resolution: 0.004 in
  • Fine Resolution: 0.002 in
  • Ultra Fine Resolution: 0.001 in

Digital Light Processing Design Recommendations

Feature Measurement

Connecting & Moving Parts

Rigid: 0.12 in
Flexible: 0.04 in

Escape Holes

Rigid: 0.04 in
Flexible: 0.04 in

Embossing & Engraving

0.02 in SIL 30
0.01 in all other material

Holes & Openings

0.002 in

Horizontal Spans

2x overhangs

Minimum Features

Rigid: 0.004 in
Flexible: 0.04 in

Pin Diameter

Rigid: 0.004 in
Flexible: 0.04 in

Supports & Overhangs

0.04 in EPU 40 &41 & SIL 30
0.08 in RPU 70 & 130, FPU 50, & EPX 82
0.12 in MPU 100 & UMA 90

Walls (Supported)

0.06 in RPU 130, EPX 82, & SIL 30
0.04 in all other materials

Walls (Unsupported)

0.1 in

Feature Measurement

Connecting & Moving Parts

Rigid: 3 mm
Flexible: 1 mm

Escape Holes

Rigid: 1 mm
Flexible: 1 mm

Embossing & Engraving

0.5 mm SIL 30
0.3 mm all other materials

Holes & Openings

0.04 mm

Horizontal Spans

2x Overhangs

Minimum Features

Rigid: 0.1 mm
Flexible: 1 mm

Pin Diameter

Rigid: 0.1 mm
Flexible: 1 mm

Supports & Overhangs

1.0 mm EPU 40 & 41 & SIL 30
2.0 mm RPU 70 & 130, FPU 50, EPX 82
3.0 mm MPU 100 & UMA 90

Walls (Supported)

1.5 mm RPU130, EPX 82, & Sil 30
1 mm all other materials

Walls (Unsupported)

2.5 mm